Sonical and XMOS have announced that Remora, a production-ready Headphone 3.0 platform powered by XMOS’ audio silicon, is now commercially available to manufacturers.
Following their joint CES 2023 announcement outlining plans to collaborate and demonstrate a working prototype, the companies have successfully delivered their first market-ready product, bringing advanced spatial audio, ultra-low latency processing and app-driven headphone experiences into a scalable production platform.
Remora with XMOS combines Sonical’s CosmOS operating system for the ear with XMOS’ XCORE multicore audio architecture, enabling brands to build next-generation wireless headphones and hearables that are software-defined and upgradeable on demand. The platform delivers AI-enabled algorithms capable of unlocking immersive, personalised audio experiences.
At CES 2023, Sonical and XMOS revealed their intention to jointly develop a new reference design for Headphone 3.0, demonstrating how open software and high-performance embedded processing could reshape the future of premium headphones.


